Call for Papers

30th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems

Müggelseeperle, Berlin

May 3–5, 2027

Humboldt-Universität zu BerlinHumboldt-Universität zu Berlin, InformatikLeibniz Institute for High Performance Microelectronics

The International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS) provides a forum for exchanging ideas, discussing research results, and presenting practical applications in the areas of design, test, security, reliability, and diagnosis of electronic circuits and systems. DDECS 2027 will be held in Berlin, Germany, in May 2027.

You are invited to participate and submit your contributions to DDECS’27. The areas of interest include (but are not limited to) the following topics:

Digital Circuit and System Design and Verification

Topic chair: Petr Fišer

Czech Technical University in Prague, Czech Republic

Embedded and Cyber-Physical Systems Applications

Topic chair: Ovidiu Petru Stan

Technical University of Cluj Napoca, Romania

Test, Reliability and Security

Topic chair: Giusy Iaria

Politecnico di Torino, Italy

Analog Design, Mixed Signal and RF

Topic chair: Anthony Coyette

Onsemi, Belgium

Submissions:

Authors are invited to submit original, unpublished contributions in the areas covered by the symposium. Submissions must follow the IEEE conference paper format. Accepted and presented papers will be included in the proceedings and, subject to IEEE requirements, submitted for inclusion in IEEE Xplore. Detailed instructions will be available on the DDECS 2027 website. DDECS 2027 also welcomes proposals for special sessions, tutorials, workshops, and PhD Forum / Student Session contributions.

Publications:

DDECS’27 will produce Formal Proceedings of accepted papers with ISBN number that will be included in the IEEE Xplore Digital Library. An Informal digest will be produced to include additional conference contents.

Key dates

Submission Deadline (Title and Abstract):
January 8th, 2027
Submission Deadline (Full Paper):
January 13th, 2027
Notification of Acceptance:
March 5th, 2027
Camera Ready:
March 24th, 2027